In the modern electronics industry, thermal management of high-power and high-frequency electronics is a key challenge. With the continuous development of power semiconductors, RF devices and optoelectronic products, the choice of materials plays a crucial role in the reliability and heat dissipation performance of the package.
Molybdenum-copper alloy (Mo-Cu) has become one of the important materials in the field of electronic packaging due to its excellent thermal conductivity, low coefficient of thermal expansion (CTE) and good mechanical strength.
Molybdenum copper materials are mainly used as heat sink materials and structural support materials in electronic packaging, and their specific functions include:
(1) Improve heat dissipation efficiency
Electronic devices will generate a lot of heat when working, and if they cannot dissipate heat in time, it will lead to the degradation of device performance or even failure. Molybdenum copper has a high thermal conductivity (typically 150-200 W/m·K), which can effectively conduct the heat generated by the device to the external heat dissipation system and improve the working stability of the device.
(2) Reduce thermal stress and improve reliability
Semiconductor materials (e.g., silicon Si, gallium arsenide GaAs, and silicon carbide SiC) will develop thermal expansion when the temperature changes, and if the thermal expansion coefficient (CTE) of the packaging material does not match it, it will lead to stress and even cracks at the interface. The CTE of molybdenum copper can be matched to semiconductor materials by adjusting the composition (e.g., Mo70Cu30, Mo60Cu40) to reduce thermal stress and improve device reliability.
(3) Enhance structural strength and durability
Compared with single metal materials (such as copper and aluminum), molybdenum-copper alloy has high mechanical strength and heat resistance, and is suitable for high-temperature and high-stress environments. In the process of long-term use, it can maintain stable physical and chemical properties, prolonging the life of electronic packaging.
(4) Improve the electrical performance of the package
In RF and microwave electronics, molybdenum-copper materials can reduce parasitic effects and improve electromagnetic compatibility (EMC) due to their lower conductivity (compared to pure copper), thereby optimizing signal transmission performance.
