W85 tungsten copper plate is composed of 85% W and 15% Cu, its density reaches(15.90g/cm3), hardness more than HB240, electric conductivity is 38%IACS, softening temperature is ≥900℃, thermal conductivity coefficient is between 180-200 (wm/k) and the coefficient of expansion is 7.0-7.5 (10-6k).
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W85 Tungsten Copper Plate Picture
W85 tungsten copper plate manufactured by PM (Powder Metallurgy) and has excellent thermal, electrical conductivity, high-temperature strength and plasticity, which is a kind of heat sink materials. In addition, it should be noticed that adjust the parameters when tungsten copper discharging or wire cutting, and the speed is lower than other materials.
